September 13 2009

Wii Fail ?

So it looks like Nintendo fucked up when they designed the Wii
They use about a nickle thick of thermal paste between the cpu and heat sink!
DSCN5087
I was getting many artifacts in the video while doing simple things like looking at the main menu
DSCN5072
trouble is figuring out how to fill this big gap? Aluminum? Copper?




Copyright © 2024. All rights reserved.

Posted September 13, 2009 by Moogle in category "Stuff

1 COMMENTS :

Leave a Reply